Beamworks Spark 400 Selective Solder Pick and Place Dispenser SMT PCB Laser Wave

$25000.0 Buy It Now or Best Offer
free,30-Day Returns

Seller Store starbillias
(410) 100.0%,

Location: Dracut, Massachusetts
Ships to: US,
Item: 144025373253

All returns accepted:ReturnsNotAccepted
Return policy details:
Beamworks:Beamworks
Spark 400:Spark 400
Country/Region of Manufacture:Israel

Very Nice Beamworks Spark 400 Selective Laser Solder Machine For Sale See attached pictures and information below Solder Paste Dispensing Rotary positive displacement pump with Archimedean screw For accurate and controlled paste deposit Dispensing Capability Line dispensing: down to 0.4 mm (0.016”) pitch Dot dispensing: down to 0.3 mm (0.012”) in diameter Capability to dispense solder paste or epoxy dots and lines Pick & Place Feeder slots – 29 standard MTH (Matrix Tray Handling)- 3 standard (configuration dependant) Up to 20 in a magazine handler (optional) Component handling – Up to 75 mm (2.95”) and down to 0402 Throughput – Up to 1, 000 CPH Vision capability – Matrox based algorithms Laser Soldering Module 2 laser diodes – 30 W each Independent optical system for each laser to direct XY movement Closed loop operation utilizing IR sensors to control solder joint temperature Input Data Standard CAD files Also requires BOM file Combined CAD & BOM Converted P&P machine file – Using on-board file converter Components library size 2000 SMT components Jedec tray library size 125 trays Complete with PC, Keyboard, Monitor, Mouse, and Manuals Dimensions: 1, 000mm x 1, 300mm x 1, 600mm Weight: 900 Kg 230 Volt – 50 HZ – 32 AMPS – Single Phase 110 Volt – 60 HZ – 32 AMPS – Double Phase Typical Applications Quick Turn Prototype Assembly NPI and Small Lot Production Complete SMT Assembly Line for Engineering Labs Automated Mass Rework, Including BGAs Selective Assembly of Planned (and Unplanned) Missing SMT Components Selective Assembly of SMT Connectors, RF Shields, Through Hole Components, Heat Sensitive Components, Paste in Hole, Optical Components and Smart Cards, Moisture Sensitive Components Lead Free High Temperature Soldering Re-balling All types of BGA Flip-Chip & CSP Assembly Unique & special Applications Main Benefits: Closed Loop Temperature Controlled Soldering No Stencil Required Flexible Operation Allows for Fast Turn Around Precise Heating without impacting Adjacent Components Auto Load of CAD and BOM Data Small Footprint Thin Inter-metallic Layer for Improved Reliability No Baking of Moisture Sensitive Components Full SMEMA Support Allows IN-Line Operation Either Stand Alone or In-Line Operation Buyer is responsible for all shipping charges from our location We can set up packaging and shipping to countries overseas by boat or airplane Installation and Training available at extra cost!! Please let us know if you have any questions or concerns Thanks and have a nice day!

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